PMEG6020ER_1 All information provided in this document is subject to legal disclaimers. ? NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 3 March 2010 10 of 14
NXP Semiconductors
PMEG6020ER
2 A low VF
MEGA Schottky barrier rectifier
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
PMEG6020ER SOD123W 4 mm pitch, 8 mm tape and reel -115
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering footprint SOD123W
2.9
2.8
4.4
2.1
1.6
1.1
1.2
×)
(2×)
(2
solder lands
solder resist
occupied area
solder paste
1.1
(2×)
1.2
(2×)
sod123w_fr
Dimensions in mm
*型号 *数量 厂商 批号 封装
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